Cases
1.Organosilicon
a.
Reference formula (room temperature curing)
Component | Brand | Number of copies |
Resin | 107 | 100 |
Plasticizer | Silicone oil | 10~30 |
Flame retardant powder | JLH-A1D7 | 130 |
Collaborative flame retardant | Melamine phosphate | 40 |
Gas silicon | H18 | 5 |
| UV absorbent | Tinuvin 326 | 4 |
light stabilizer | Tinuvin 770 | 4 |
Crosslinking agent | Silane coupling agent | 1~3 |
catalyst | Organic tin or organic titanium | 1~2 |
b.Performance testing
Test project | Unit | Experimental data |
Droop | min | ≤3 |
Surface drying time | min | 30 |
Extrudability | mL/min | 90 |
Shear strength | Mpa | 1.7 |
Breaking strength | Mpa | 1.5 |
Elongation at break | % | 300 |
Flame retardant grade | HB | Qualified |
Test environment: 23 ℃. 50% RH. The above data is laboratory reference data
2.Product Application Cases
a. Reference formula (curing conditions: 30 minutes/100 ℃)
Component | Brand | Number of copies |
Resin | Bisphenol F epoxy resin | 50 |
Reactive diluent | E10P | 20 |
Flame retardant powder | JLH-A1D7 | 120 |
Synergist | 25 | |
Latent curing agent | Adeka EH-5031S | 50 |
stabilizer | Huntsman Arocy B10 | 10 |
UV absorbent | Tinuvin 326 | 1 |
Test environment: 23 ℃, 50% RH, curing. The above data are laboratory reference data
b.Performance testing
Test project | Unit | Experimental data |
Cure temperature | ℃ | 130 |
Curing Time | min | 15 |
Hardness | 邵氏D | 80 |
Tensile modulus | MPa | 200 |
| Tensile strength | N/mm2 | 25 |
Elongation | % | 3 |
Halide Content | ppm | 900 |
Flame retardant grade | A2 | qualified |
Test environment: 23 ℃, 50% RH, curing. The above data are laboratory reference data
3.copper clad laminate
Comparison of the effect with corresponding foreign brands when adding 43%
Test project | Unit | X04IO | X04LEO | A1D9 | ||||||
| TG | ℃ | 125.0/126.1 | 124.0/125.9 | 126.5/127.6 | ||||||
| TD | ℃ | 315.2 | 314.7 | 314.4 | ||||||
| T288 | min | 1.07 | 0.50 | 1.29 | ||||||
| CTE | ppm/% | α1 | α2 | Z轴 | α1 | α2 | Z轴 | α1 | α | Z轴 |
| 40.38 | 274.7 | 4.20% | 47.83 | 333.1 | 5.07% | 31.12 | 288.7 | 4.25% | ||
Floating welding | sec | 100 | 108 | 126 | ||||||
dip Soldering | sec | 80 | 86 | 90 | ||||||
Thermal shock | 次 | 4 (288℃/10Sec) | 4 (288℃/10Sec) | 6 (288℃/10Sec) | ||||||
Peel strength | N/mm | 1.57 1.58 | 1.62 1.58 | 1.63 1.58 | ||||||
Flame retardant | sec | V0(max:2.3 sum:5.8) | V0(max:2.2 sum:6.3) | V0(max:2.8 sum:6.6) | ||||||
Application of Modified Aluminum Hydroxide on Organosilicon
Type of base material | Methyl vinyl silicone gel | ||||||
Test brand | A1D4 | A1D9 | A1D10 | A1D12 | A5D15 | A5D7 | A1D7 |
Addition amount% | 40 | 40 | 40 | 40 | 40 | 50 | 40 |
tensile strength Mpa | 4.1 | 4.4 | 3.8 | 5.2 | 4.9 | 6.5 | 4.9 |
Tear strength | 14.4 | 15.1 | 13.8 | 16.5 | 15.6 | 17.3 | 25.1 |
Elongation at break % | 275 | 306 | 252 | 335 | 233 | 201 | 523.2 |
Proportion | 1.45 | 1.45 | 1.45 | 1.45 | 1.45 | 1.45 | 1.45 |
Hardness | 62 | 62 | 62 | 62 | 62 | 68 | 62 |
Flame retardant grade | V1 | V1 | V1 | V1 | V1 | V0 | V1 |